Bob Wettermann

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Key Uses of Rework Stencils

When a device needs to come off a PCB and be replaced due to improper orientation, wrong part number or value, defective solder fillets the operation is a rework of a PCB. The processes for taking off different parts are governed by the industry workbook IPC 7711/21 Rework and Repair of Printed Circuit Boards.

Some of the processes for reworking devices are such that hand soldering is used for common devices for SMT connectors, passive components, PLCCs and others. There is however other more complex devices, many of which have non inspectable solder fillet areas that require a different rework method. Common devices requiring rework that consists of mimicking the initial assembly process include but are not limited to devices such as QFPs, BGAs and QFNs. When reworking these devices the device is first removed and site prepped and cleaned. In many cases the solder is re-applied using a...

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High Quality Repair Kit for Frequent BGA Rework and Repair

BGA rework is the action of taking off an allegedly defective BGA and replacing it with either a reballed device or a new one. BGA repair includes the reballing of the device which means replacement solder balls are placed on the underside of the device.
Basically, BGA repair kit can be used in many ways for reworking and repairing BGA locations on a printed circuit board when there is an emergency. Here, you will find various options of using this kit.

These reballing kits provide the benefits of repainting the damaged mask underneath a BGA as well as providing assistance in reliably and quickly placing a BGA onto a PCB for repair event when the high end equipment is not available.

By using the “universal patterns” found in this kit along with Kapton™ tape and a sharp, precise-cutting Exacto™ blade the patterns of your BGA can be formed. This means the repair can be done right away...

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