High Quality Repair Kit for Frequent BGA Rework and Repair

BGA rework is the action of taking off an allegedly defective BGA and replacing it with either a reballed device or a new one. BGA repair includes the reballing of the device which means replacement solder balls are placed on the underside of the device.
Basically, BGA repair kit can be used in many ways for reworking and repairing BGA locations on a printed circuit board when there is an emergency. Here, you will find various options of using this kit.

These reballing kits provide the benefits of repainting the damaged mask underneath a BGA as well as providing assistance in reliably and quickly placing a BGA onto a PCB for repair event when the high end equipment is not available.

By using the “universal patterns” found in this kit along with Kapton™ tape and a sharp, precise-cutting Exacto™ blade the patterns of your BGA can be formed. This means the repair can be done right away. If many of the same type of repair are required then BEST can configure a repair stencil for the exacting requirements thereby eliminating the labor required to “customize” the standard universal patterns for the specific site location.

The Kapton™ acts as a mask repair “bandage” repairing mask that has been damaged in the removal of the BGA, too many heat cycles or by the improper undercutting or etching process in fabricating the PCB. These Kapton dams also help prevent solder from shorting between adjacent ball locations. Finally this Kapton™ material acts to provide very high insulation resistance between neighboring balls.

This is the way BGA reballing kit is used for reworking and simultaneously repairing BGA locations on a PCB.